University at Buffalo Partners with UD-DUT to Expand International Academic Pathways

Cross-Continental Collaboration: UD-DUT and UB Unite for Research and Innovation

Education has long served as a vital bridge between nations, and this enduring principle was recently exemplified through a meaningful collaboration between a prominent Vietnamese university and a distinguished American institution. In the spirit of international cooperation, the University of Science and Technology, the University of Danang (UD-DUT), reportedly hosted a working session on 14 July 2025 with the University at Buffalo (UB), a renowned public university based in New York State, USA.

During the session, both universities are understood to have formalised their partnership by signing a Memorandum of Understanding (MoU). Through this agreement, the institutions aim to deepen academic ties and broaden joint initiatives, thereby reflecting a shared commitment to advancing global education and research. Associate Professor Le Tien Dung, Vice-Rector of UD-DUT, affirmed that the MoU would enhance academic and research collaboration by harnessing the strengths of both universities in Embedded Systems, the Internet of Things (IoT), and Electronics and Telecommunications Engineering.

In turn, Professor Kemper Lewis, Rector of the School of Engineering and Applied Sciences at UB, emphasised that the University at Buffalo, established in 1846, is a highly respected public institution with a robust foundation in science and engineering. He further noted its diverse academic community, comprising approximately 30,000 students, including 5,000 international students from nearly 100 countries. Representatives from UB reportedly expressed strong enthusiasm for the partnership, underscoring the alignment between the two institutions’ engineering and technology programmes. They conveyed optimism that the collaboration would foster enduring ties centred on knowledge exchange, innovation, and global engagement.

As stipulated in the agreement, the universities intend to establish international joint training programmes with academic transfer pathways in Embedded Systems, IoT, and Electronics and Telecommunications Engineering at both undergraduate and postgraduate levels. Furthermore, the partnership encompasses faculty and student exchanges, collaborative research and teaching, as well as the co-development of bilateral projects. This collaboration marks a significant step towards cultivating a globally connected academic community rooted in shared expertise and mutual advancement.

Editor’s Note

The recent partnership between the University of Science and Technology, the University of Danang (UD-DUT), and the University at Buffalo (UB), USA, is more than just a formal agreement; it is a smart step towards improving higher education for the future. At a time when global education is changing quickly, collaborations like this help improve teaching, research, and student learning. Both universities bring notable strengths to the partnership. UD-DUT is a leading Vietnamese engineering institution with internationally recognised programmes in Embedded Systems, IoT, and Electronics and Telecommunications Engineering. UB, a top U.S. public research university founded in 1846, hosts over 30,000 students and has an annual research budget exceeding $540 million. The MoU signed on 14 July 2025 paves the way for joint academic programmes, faculty and student exchanges, and collaborative research. Key features include academic transfer pathways, offering students access to dual strengths and enhanced global career prospects.

Skoobuzz believes that in today’s world, where education must be flexible, international, and open to different fields, this partnership is a good example for others to follow. It shows a shared goal of preparing students to succeed globally and creating new knowledge through teamwork.